The DER-IC network is working to address challenges across a range of PEMD thematic groups.
Semiconductor Fabrication
Wafers and dies: Silicon and wide band gap device processes for integrated circuits and discrete devices
Packaging and Devices
Innovative packaging solutions, and device performance optimisation
Magnetics
Design, optimisation and processing of hard magnetic systems and electrical steels for efficiency, losses, and performance
Rotors and Stators
Design optimisation and assembly processes for lamination stacks and casings
Windings and Busbars
Innovative topologies, low-inductance interconnect and automated assembly
Drives and Integration
System compatibility, optimisation and control strategies and overall performance
Thermal Management
Thermal analysis, heat dissipation strategies, integrated cooling and thermal interface
Passives, Non-Active Parts, and Lightweighting
Innovative materials and manufacturing methods