The DER-IC network is working to address challenges across a range of PEMD thematic groups.

Semiconductor Fabrication
Wafers and dies: Silicon and wide band gap device processes for integrated circuits and discrete devices

Packaging and Devices
Innovative packaging solutions, and device performance optimisation

Design, optimisation and processing of hard magnetic systems and electrical steels for efficiency, losses, and performance 

Rotors and Stators
Design optimisation and assembly processes for lamination stacks and casings 

Windings and Busbars
Innovative topologies, low-inductance interconnect and automated assembly 

Drives and Integration
System compatibility, optimisation and control strategies and overall performance 

Thermal Management
Thermal analysis, heat dissipation strategies, integrated cooling and thermal interface 

Passives, Non-Active Parts, and Lightweighting
Innovative materials and manufacturing methods